Polyimide Film Micromachining by Wet-Etching Technology

Wet anisotropic etching of polyimide

With the aim of developing flexible biocompatible implants for in vivo studies of nerve regeneration [1], fabrication of passive polyimide membranes using the commercial available Kapton film (100HN and 50HN, from DuPont) was investigated. Polyimide has been widely used in microelectronics, and its application possibilities have been widening to other fields such as micromachining and biomedica...

Dry Etching Based Silicon Micromachining

The aim of this work is to demonstrate the “dry” etching based micro-fabrication technologies in the manufacturing of Single Crystal Silicon (SCS) for Micro-Electro/(Optical)-Mechanical-Systems (ME(O)MS). The ME(O)MS technology is very fast growing industry branch based often on the same silicon technology as integrated circuits. The process of plasma-dry etching is quite simple straightforward...

Wet and Dry Etching Theory

Quadrilateral Micro-Hole Array Machining on Invar Thin Film: Wet Etching and Electrochemical Fusion Machining

Ultra-precision products which contain a micro-hole array have recently shown remarkable demand growth in many fields, especially in the semiconductor and display industries. Photoresist etching and electrochemical machining are widely known as precision methods for machining micro-holes with no residual stress and lower surface roughness on the fabricated products. The Invar shadow masks used ...

A comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching

Wet anisotropic etching based silicon micromachining is an important technique to fabricate freestanding (e.g. cantilever) and fixed (e.g. cavity) structures on different orientation silicon wafers for various applications in microelectromechanical systems (MEMS). {111} planes are the slowest etch rate plane in all kinds of anisotropic etchants and therefore, a prolonged etching always leads to...